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JUKI 2010 2050 2070 2080 BU ENCODER ASM E94337290A0 TS5204N556
Surface-mount technology (SMT) is a method in which the electrical components are mounted directly onto the surface of a printed circuit board
(PCB). An electrical components mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.
An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.
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Welcome to Surface Mount Process
This website has been created primarily to be a technical resource for surface mount process engineers and also for anyone with an interest in surface mount technology (SMT). The scope of the website will be all aspects of the manufacturing process from solder paste printing, solder paste inspection, component placement, reflow soldering through to automatic optical inspection (AOI) and will include answers to the many frequently asked questions!
Contact Person: David