Place of Origin: | Japan |
Brand Name: | FUJI |
Certification: | CE |
Model Number: | XK04640X |
Minimum Order Quantity: | 1 Piece |
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Price: | negotiation |
Packaging Details: | paper box |
Delivery Time: | 1-3 days |
Payment Terms: | T/T, Western Union, Paypal |
Supply Ability: | 10000 pcs/month |
Part Number: | XK04640X | Condition: | Original New |
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Machine Model: | For FUJI | Shipping Terms: | Air Or Ocean |
Delivery Time: | 1-3 Days | Packing: | Carton Box |
Model Machine: | FUJI GAUGE NOZZLE CENTRE JIG | Material: | Plastic |
Material: | Stainless Steel | Oother Services: | Repair Available |
High Light: | smt machine parts,fuji replacement parts |
CE Approval Fuji Spare Parts NXT2 CPU BOARD XK04640X With 1 Month Guarantee
Specifications:
Brand Name | FUJI NXT2 CPU BOARD XK04640X |
Part Number | XK04640X |
Model Type | FUJI SMT MACHINE SPARE PARTS |
Ensure | Tested in machine confirmation |
Warranty | 2 Months |
Guarantee | Original 100% |
Usage Machine | FUJI NXT H01 H02 H04 H08 H12 H24 HEAD NOZZLES, FEEDERS, SPARE PARTS |
Delivery Terms | EXW, FOB, CIF |
Structure Detail:
Supply Ability:
Supply original new Fuji spare parts at reasonable discount:
Stock Details:
Description | Part Number | Model | Size |
Yamaha Feeder | KHJ-MC100-001 | SS | 8mm |
Yamaha Feeder | KHJ-MC200-100 | SS | 12/16mm |
Yamaha Feeder | KHJ-MC400-002 | SS | 24mm |
Yamaha Feeder | KHJ-MC700-001 | SS | 56mm |
Yamaha Feeder | KLJ-MC200-004 | ZS | 12/16mm |
Yamaha Feeder | KLJ-MC500-002 | ZS | 32mm |
Yamaha Feeder | KLJ-MC700-002 | ZS | 56mm |
SMT Application:
Surface mount technology, SMT and its associated surface mount devices, SMDs considerably speed up PCB assembly as the components simply mount on the board.
Look inside any piece of commercially made electronic equipment these days and it is filled with minute devices. Rather than using traditional components with wire leads like those that may be used for home construction and kits, these components are mounted onto the surface of the boards and many are minute in size.
1. Good mechanical performance under shock and vibration conditions (partly due to lower mass, and partly due to less cantilevering)
2. Lower resistance and inductance at the connection; consequently, fewer unwanted RF signal effects and better and more predictable high-frequency performance.
3. Better EMC performance (lower radiated emissions) due to the smaller radiation loop area (because of the smaller package) and the lesser lead inductance.
4. Fewer holes need to be drilled. (Drilling PCBs is time-consuming and expensive.)
5. Lower initial cost and time of setting up for mass production, using automated equipment.
Contact Person: David
Tel: +86-13554806940